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The aim of the process is to form acceptable solder joints by first pre-heating the componentsPCBsolder paste and then melting the solder without causing damage by overheating.
How to do reflow soldering. To do reflow soldering you should have the following tools. Reflow Surface Mount SMD Soldering Tutorial. Solder paste in a syringe.
Apply solder paste to the PCB with a screen or stencil using a thickness range of 015mm 0006 to 025 0010. In reflow soldering we make a solder paste out of powdered solder and flux then use that paste to attach components to contact pads. It uses an infrared lamp to heat the air and melt the solder.
Start the process by applying flux to the pads to make sure they are clean and will get heated properly. Most heat guns work at 1000 watts but only some of them have temperature control gauges. One of the best ways is applying the components and solder paste onto the board.
The solder paste reflows in a molten state creating permanent solder joints. You can trust ControLeo and let it handle the temperature curve. And one of the following.
SAC Solder ball Low temp BiSnAg Paste Before Reflow After Reflow Bismuth diffused region Un-melted SAC Solder Ball Package Board Low Temp Solder LTS Board BiSn5742 Ag x04-1 SnAgCu 965305 SnAgCu 955405 In use today for consumer TVs White Goods LED products SAC alloys Eutectic Tin-Lead Alloy SnPb6337 Bismuth-Tin. To sum it up the reflow soldering process is ideal for soldering a large number of surface-mount electrical components on a board. Wave soldering on the other hand is generally preferred for attaching multi-leaded through-hole components to circuit boards that are designed for surface-mount components.
Reflow soldering is the most widely used method of attaching surface mount components to printed circuit boards PCBs. The soldering takes place in a tunnel or reflow oven under controlled heating to prevent thermal shock and strengthen the joints. You can also use reflow ovens to solder through-hole components simply by filling the through-hole holes with solder paste and inserting the component leads through the paste.
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